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CXA1645P/M
RGB Encoder For the availability of this product, please contact the sales office.
Description The CXA1645P/M is an encoder IC that converts analog RGB signals to a composite video signal. This IC has various pulse generators necessary for encoding. Composite video outputs and Y/C outputs for the S terminal are obtained just by inputting composite sync, subcarrier and analog RGB signals. It is best suited to image processing of personal computers and video games. Features * Single 5V power supply * Compatible with both NTSC and PAL systems * Built-in 75 drivers (RGB output, composite video output, Y output, C output) * Both sine wave and pulse can be input as a subcarrier. * Built-in band pass filter for the C signal and delay line for the Y signal * Built-in R-Y and B-Y modulator circuits * Built-in PAL alternate circuit * Burst flag generator circuit * Half H killer circuit Applications Image processing of video games and personal computers Block Diagram and Pin Configuration
GND2 24 ROUT 23 GOUT 22 BOUT 21 CVOUT 20 VCC2 19 FO 18 YTRAP 17 YOUT 16 COUT 15 VREF 14 IREF 13
24 pin DIP (Plastic)
24 pin SOP (Plastic)
Structure Bipolar silicon monolithic IC Absolute Maximum Ratings 14 V * Supply voltage VCC * Operating temperature Topr -20 to +75 C * Storage temperature Tstg -65 to +150 C * Allowable power PD CXA1645P 1250 mW dissipation CXA1645M 780 mW Recommended Operating Condition Supply voltage VCC1, 2 5.0 0.25
V
VIDEO OUT R-OUT G-OUT B-OUT
Y/C MIX
75 DRIVER
75 DRIVER REGULATOR
DELAY
CLAMP
SYNC ADD BPF R-Y Modulator
MATRIX
B-Y Modulator PHASE SHIFTER PULSE GEN
CLAMP
CLAMP
CLAMP
SIN-PULSE
1 GND1
2 RIN
3 GIN
4 BIN
5 NC
6 SCIN
7 NPIN
8 BFOUT
9 YCLPC
10 SYNCIN
11 NC
12 VCC1
Sony reserves the right to change products and specifications without prior notice. This information does not convey any license by any implication or otherwise under any patents or other right. Application circuits shown, if any, are typical examples illustrating the operation of the devices. Sony cannot assume responsibility for any problems arising out of the use of these circuits.
-1-
E93411A41-ST
CXA1645P/M
Pin Description Pin No. Symbol Pin voltage Equivalent circuit
Externally applied voltage Description Ground for all circuits other than RGB, composite video and Y/C output circuits. The leads to GND2 should be as short and wide as possible.
VCC1
1
GND1
0V
2 3 4
RIN GIN BIN
Black level when clamped 2.0V
2
100
4
180
GND1
ICLP
5
NC
VCC1
100
3
Analog RGB signal inputs. Input 100%, = 1Vp-p (max.). To minimize clamp error, input at as low impedance as possible. ICLP turns ON only in the burst flag period.
NO CONNECTION
6
SCIN
--
6
20P 20k 129 20k 2.5V 100 GND1
Subcarrier input. Input 0.4 to 0.5Vp-p sine wave or pulse. Refer to Notes on Operation, Nos. 3 and 5.
VCC1 80k
68k
7
NPIN
1.7V
7 3k
Pin for switching between NTSC and PAL modes NTSC: VCC, PAL: GND
32k GND1
VCC1
8
BFOUT
H : 3.6V L : 3.2V
8 129 25 25 GND1
BF pulse monitoring output. Incapable of driving a 75 load.
-2-
CXA1645P/M
Pin No.
Symbol
Pin voltage
Equivalent circuit
Description
VCC1 129
9
YCLPC
2.5V
9
Pin to determine the Y signal clamp time constant. Connect to GND via a 0.1F capacitor.
5 1.6V GND1
VCC1 40k
10
SYNC IN
2.2V
10 4k
Composite sync signal input. Input TTLlevel voltages. L ( 0.8V): SYNC period H ( 2.0V)
2.2V GND1
12
VCC1
5.0V
Power supply for all circuits other than RGB, composite video and Y/C output circuits. Refer to Notes on Operation. Nos. 4 and 10.
VCC1
13
IREF
2.0V
13 129 50 GND1
Pin to determine the internal reference current. Connect to GND via a 47k resistor.
VCC1
14
VREF
4.0V
14
Internal reference voltage. Connect a decoupling capacitor of approximately 10F. Refer to Notes on Operation, Nos. 4 and 7.
GND1
-3-
CXA1645P/M
Pin No.
Symbol
Pin voltage
Equivalent circuit
Description
VCC2 VCC1 600
15
COUT
2.2V
Chroma signal output. Capable of driving a 75 load.
15
10k
20k
Refer to Notes on Operation, Nos. 6 and 9.
GND2
VCC2 VCC1 600
16
YOUT
Black level 1.3V
Y signal output. Capable of driving a 75 load.
16
10k
20k
Refer to Notes on Operation, Nos. 6 and 9.
GND2
VCC1
17
YTRAP
Black level 1.6V
8.5k 17 1.5k 0.5P
Pin for reducing cross color caused by the subcarrier frequency component of the Y signal. When the CVOUT pin is in use, connect a capacitor or a capacitor and an inductor in series between YTRAP and GND. Decide capacitance and inductance, giving consideration to cross color and the required resolution. No influence on the YOUT pin. Refer to Notes on Operation, No. 8.
GND1 Input resistance 1.5k
VCC1
18
FO
2.0V
18 129 50 GND1
Internal filter fo adjustment pin. Connect to GND via the following resistor according to the NTSC or PAL mode. NTSC: 20k (1%) PAL : 16k (1%)
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CXA1645P/M
Pin No.
Symbol
Pin voltage
Equivalent circuit
Description Power supply for RGB, composite video and Y/C output circuits. Decouple this pin with a large capacitor of 10F or above as a high current flows. Refer to Notes on Operation, Nos. 4 and 10.
19
VCC2
5.0V
VCC2 VCC1 600
20
CVOUT
Black level 1.2V
Composite video signal output. Capable of driving a 75 load.
20 20k
GND2
500
VCC2 VCC1
10k
Refer to Notes on Operation, Nos. 6 and 9.
21 22 23
BOUT GOUT ROUT
Black level 1.7V
21 22 23 5.5k
Analog RGB signal outputs. Capable of driving a 75 load. Refer to Notes on Operation, Nos. 6 and 9.
200 GND1 GND2
24
GND2
0V
Ground for RGB, composite video and Y/C output circuits. The leads to GND1 should be as short and wide as possible.
-5-
CXA1645P/M
Electrical Characteristics
(Ta = 25C, VCC = 5V, See the Electrical Characteristics Measurement Circuit.)
S1 S2 S3 S4 S5 Measurement Conditions No input signal, SG5: CSYNC TTL level, SG4: SIN wave 3.58MHz 0.5Vp-p Fig. 1 Min. Typ. Max. Unit Measu RIN rement SYNC GIN SCIN NPIN FO point IN BIN ICC1 2V SG4 5V SG5 20k
Item
Symbol
Current consumption 1 Current consumption 2 (R, G, BOUT)
ICC1
31 mA 12
ICC2
ICC2
VO (R) RGB output voltage VO (G) VO (B) fC (R) RGB output frequency characteristics fC (G) fC (B) (YOUT & CVOUT) Output sync level R100%: Y level G100%: Y level B100%: Y level White 100%: Y level VO (YS1/2) VO (YR1/2)
SG1 SG2 SG3 SG1 SG2 SG3 2V 2V
D E F D E F
SG1 to SG3: DC direct coupling 2.5VDC, 1.0Vp-p f = 200kHz Pin 9 = Clamp voltage Fig. 2 SG1 to SG3: DC direct coupling 2.5VDC, 1.0Vp-p f = 200kHz/5MHz Pin 9 = Clamp voltage Fig. 3
0.64
0.71
0.78
Vp-p
-3.0
dB
SG1 0V VO (YG1/2) to SG3 VO (YB1/2) VO (YW1/2)
5V SG5 20k
B/C
SG1 to SG3: 100% color bar input, 1.0Vp-p (Max.) SG5: CSYNC TTL level Fig. 4 SG1 to SG3: DC direct coupling 2.5VDC, 1.0Vp-p f = 200kHz/5MHz Pin 9 = Clamp voltage Fig. 3
0.26 0.17 0.35 0.065 0.6
0.29 0.21 0.42 0.08 0.71
0.33 0.26 0.49 0.095 0.82
Vp-p V V V V
Output frequency characteristics
fC (Y1/2)
SG1 to 0V SG3
5V
2V
20k
-3.0
dB
Clamp voltage: voltage appearing at Pin 9 when CSYNC is input.
-6-
CXA1645P/M
S1 Item Symbol
S2
S3
S4
S5 Measurement Conditions Min. Typ. Max. Unit
Measu RIN rement SYNC GIN SCIN NPIN FO point IN BIN
(COUT & CVOUT) Burst level R chroma ratio R phase G chroma ratio G phase B chroma ratio B phase Burst width Burst position VO (BN1/2) R/BN1/2 R1/2 G/BN1/2 G1/2 B/BN1/2 B1/2 SG1 to SG4 SG3 SG1 to SG3: 100% color bar input, 1.0Vp-p (Max.) SG4: SIN wave, 3.58MHz 0.5Vp-p SG5: CSYNC TTL level Fig. 5 0.2 2.84 94 2.65 231 2.01 337 2.5 0.4 A/C SG1 to SG4 SG3 SG1 to SG3: No signal, SG4: SIN wave, 3.58MHz 0.5Vp-p SG5: CSYNC TTL level 3.58MHz component measured. Fig. 6 SG1 to SG3: No signal, SG4: SIN wave, 4.43MHz 0.5Vp-p SG5: CSYNC TTL level Fig. 6 0.9 125 215 1.0 135 225 0.25 3.16 104 2.95 241 2.24 347 2.75 0.6 0.3 3.48 114 3.25 251 2.47 357 3.2 0.75 deg s s deg deg Vp-p
5V SG5 20k
tW (B) 1/2 tD (B) 1/2
Carrier leak
VL1/2
5V SG5 20k
20
mVp-p
PAL burst level ratio
K (BP1/2) PAL1/2 SG1 to SG4 GND SG5 16k SG3
1.1 145 deg 235
PAL burst phase PAL1/2
Clamp voltage: voltage appearing at Pin 9 when CSYNC is input.
-7-
Electrical Characteristics Measurement Circuit
75 F 5V 220 16k 20k NTSC S5 75 NC 17 16 15 14 13 75 18 0.01 47 0.1 220 220 220 10 47k
75 E
75 D
75 C
75 B
75 A
220
220
A
75 21 20 19
75
75
75
PAL ICC2
24
23
22
VIDEO OUT Y/C MIX 75 DRIVER 75 DRIVER B-OUT
R-OUT
G-OUT
REGULATOR
DELAY CLAMP BPF R-Y Modulator
SYNC ADD
MATRIX
-8-
B-Y Modulator CLAMP SIN-PULSE PHASE SHIFTER PULSE GEN 4 7 S2 PAL 0.1 SG2 0.1 SG3 S1 NC 5 6 8 NC S3 NTSC 9 0.1 SG4 SIN 0.5Vp-p 5V 2V
CLAMP
CLAMP
1
2
3
10
11 NC S4
12
S1
S1
ICC1 A 0.01 SG5 CSYNC 5V 47
0.1 SG1
2V
CXA1645P/M
SG1 to SG3 100% color bar (1Vp-p max.)
CXA1645P/M
Measuring Signals and Output Waveforms
SG4 0.5Vp-p SCIN SG5 SYNC IN 64s 4.5s f = 3.58MHz 2.0V 0.8V SG5 SYNC IN SG1 RIN SG2 GIN SG3 BIN SG1 to 3 RIN GIN BIN DEF point ROUT GOUT BOUT VO 2.5V 1.0Vp-p BC point YOUT CVOUT Vo (YB) Vo (YW) Vo (YG) Vo (YR) Vo (YS) 1.0Vp-p 64s 4.5s 10s 1.0Vp-p 2.0V 0.8V
Fig. 1
1.0Vp-p
f = 200kHz
Fig. 4
Fig. 2
SG4 0.5Vp-p SCIN f = 3.58MHz
SG1 to 3 RIN GIN BIN DEF BC point ROUT GOUT BOUT YOUT CVOUT 2.5V 1.0Vp-p
SG5 SYNC IN 64s 4.5s 10s VO Vo (5MHz) Vo (200kHz) SG2 GIN SG1 RIN
2.0V 0.8V
f = 200kHz/5MHz
1.0Vp-p
Fig. 3
fc = 20log
1.0Vp-p
SG3 BIN SG4 0.5Vp-p SCIN f = 3.58MHz/ 4.43MHz SG4 SYNC IN C point CVOUT Vo (BN) A point COUT VL K (BP) = Vo (BN) Vo (BN) Vo (BN) 64s 4.5s Vo (BN) VL Vo (BN) tW (B) 2.0V 0.8V A point COUT VO (CB) VO (CG) VO (CR) VO (BN) C point CVOUT tD (B) VO (BN) VO (CG) VO (CB) VO (CR) tW (B)
1.0Vp-p
R/BN = G/BN = B/BN =
VO (CR) VO (BN) VO (CG) VO (BN) VO (CB) VO (BN)
Fig. 5
Fig. 6 -9-
CXA1645P/M
Application Circuit (NTSC mode)
R OUT 220 75 24 23 G OUT 220 75 22 B OUT 220 75 21 CV OUT 220 0.01 75 20 19 47 20k 18 1% NC 17 75 16 75 15 14 13 C OUT 220 Y OUT 220 10 47k 0.1
VCC +5V
VIDEO OUT R-OUT G-OUT B-OUT
Y/C MIX
75 DRIVER
75 DRIVER REGULATOR
DELAY
CLAMP
SYNC ADD BPF R-Y Modulator
MATRIX
B-Y Modulator PHASE SHIFTER PULSE GEN
CLAMP
CLAMP
CLAMP
SIN-PULSE
1
2
3
4
5 NC
6
7
8 NC
9 0.1
10
11 NC 0.01
12
0.1
0.1
0.1 SCIN SYNC IN Metal film resistor 1%
47
R IN
G IN
B IN
Application Circuit (PAL mode)
R OUT 220 75 24 23 G OUT 220 75 22 B OUT 220 75 21 CV OUT 220 0.01 75 20 19 47 16k 18 1% C OUT 220 75 16 Y OUT 220 75 15 14 13 10 47k 0.1
VCC +5V
NC 17
VIDEO OUT R-OUT G-OUT B-OUT
Y/C MIX
75 DRIVER
75 DRIVER REGULATOR
DELAY
CLAMP
SYNC ADD BPF R-Y Modulator
MATRIX
B-Y Modulator PULSE GEN
CLAMP
CLAMP
CLAMP
SIN-PULSE
PHASE SHIFTER
1
2
3
4
5 NC
6
7
8 NC
9 0.1
10
11 NC
12
0.1
0.1
0.1 SCIN SYNC IN Metal film resistor 1% 0.01 47
R IN
G IN
B IN
Application circuits shown are typical examples illustrating the operation of the devices. Sony cannot assume responsibility for any problems arising out of the use of these circuits or for any infringement of third party patent and other right due to same.
- 10 -
CXA1645P/M
Description of Operation Analog RGB signals input from Pins 2, 3 and 4 are clamped in the clamping circuit and output from Pins 23, 22 and 21, respectively. The matrix circuit performs operations on each input signal, generating luminance signal Y and color difference signals R-Y and B-Y. The Y signal enters the delay line to adjust delay time with the color signal C. Then, after addition of the CSYNC signal input from Pin 10, the Y signal is output from Pin 16. A subcarrier input from Pin 6 is input to the phase shifter, where its phase is sfited 90. Then, the subcarrier is input to the modulators and modulated by the R-Y signal and the B-Y signal. Modulated subcarriers are mixed, sent to the band pass filter to eliminate higher harmonic components and finally output from Pin 15 as the C signal. At the same time, Y and C signals are mixed and output from Pin 20 as the composite video signal.
Burst Signal The CXA1645P/M generates burst signals at the timing shown below according to the composite sync signal input. H synchronization
SYNC IN (TTL level) tD (B) tW (B)
C VIDEO OUT Burst signal
COUT
tD (B)
tW (B)
V synchronization
ODD SYNC IN EVEN
ODD C VIDEO OUT EVEN Burst signal Synchronizing signal
- 11 -
CXA1645P/M
Notes on Operation Be careful of the following when using the CXA1645P/M. 1. This IC is designed for image processing of personal computers and video games. When using the IC in other video devices, make thorough investigations on image quality. 2. Be sure that analog RGB signals are input at 1.0Vp-p maximum and have low enough impedance. High impedance may affect color saturation, hue, etc. Inputting RGB signals in excess of 1.3Vp-p may disable the clamp operation. 3. The SC input (Pin 6) can be either a sine wave or a pulse in the range from 0.4 to 5.0Vp-p. However, when a pulse is input, its phase may be shifted several degrees from that of the sine wave input. In the IC, the SC input is biased to 1/2 VCC. Accordingly, when a 5.0Vp-p pulse is input and the duty factor deviates from 50%, High- and Low-level pulse voltages may exceed VCC and GND in the IC, which causes subcarrier distortion. In such a case, be very careful that the duty factor keeps to 50%. 4. When designing a printed circuit board pattern, pay careful attention to the routing of the VCC and GND leads. To decouple the VCC and VREF pins, use tantalum, ceramic or other capacitors with good frequency characteristics. Ground the capacitors by connections shown below as closely to each IC pin as possible. Try to design the leads as short and wide as possible. VCC1, VREF VCC2 ... GND1 ... GND2
Design the pattern so that VCC (or VREF) is connected to GND via a capacitor at the shortest distance. 5. SC and SYNC input pulses Attach a resistor and a capacitor to eliminate high-frequency components of SC (Figure A) and SYNC (Figure B) before input. Fig. A
2.2k 5P
Fig. B
2.2k 47P
Be careful not to input pulses containing high-frequency components. Otherwise, high-frequency components may flow into VCC, GND and peripheral parts, resulting in malfunctions. 6. Connecting an external resistor to the 75 driver output pin A capacitance of several dozen picofarads at each pin may start oscillation. To prevent oscillation, design the pattern so that a 75 resistor is mounted near the pin (see Figure C). Fig. C
75 Make these leads short.
When any of the 75 driver output pins is not in use, leave it unconnected and design the pattern so that no parasitic capacitance is generated on the printed circuit board. - 12 -
CXA1645P/M
7. VREF pin (Pin 14) Do not connect this pin to an external load that might cause AC signals to flow, which will cause IC malfunctions. When connecting a DC load, make sure that the current flowing from this pin is kept below 2mA. 8. YTRAP pin (Pin 17) There are the following two means of reducing cross color generated by subcarrier frequency components contained in the Y signal. (1) Install a capacitor of 30 to 68pF between YTRAP and GND. Decide the capacitance by conducting image evaluation, etc., giving consideration to both cross color and resolution. Relations between capacitance and image quality are as follows: Capacitance Cross color Resolution 30pF 68pF Large Small High Low
17 C
(2)
Connect a capacitor C and an inductor L in series between YTRAP and GND. When the subcarrier 1 frequency is fo, the values C and L are determined by the equation fo = . Decide the values in 2 LC image evaluation, etc., giving consideration to both cross color and resolution. Relations between inductor values and image quality are as follows: Inductor value Cross color Resolution Small Large Large Small High Low
17 C L
For instance, L = 68H and C = 28pF are recommended for NTSC. It is necessary to select an inductor L with a sufficiently small DC resistance. Method (2) is more useful for achieving a higher resoluation than method (1). When an even higher resolution is necessary, use of the S terminal (YOUT and COUT) is recommended. 9. Driving COUT (Pin 15), YOUT (Pin 16), CVOUT (Pin 20), and B.G.R OUT (Pins 21, 22 and 23) outputs In Pin Description, "Capable of driving a 75 load" means that the pin can drive a capacitor +75 +75 load shown in the figure below. In other words, the pin is capable of driving a 150 load in AC.
75 PIN 75 220F
Keep in mind that the pin is incapable of driving a 150 load in DC load in DC direct coupling. 10. This IC employs a number of 75 driver pins, so oscillation is likely to occur when measures described in Nos. 4 and 6 are not taken thoroughly. Be very careful of oscillation in printed circuit board design and carry out thorough investigations in the actual driving condition.
- 13 -
CXA1645P/M
Package Outline CXA1645P
Unit: mm
24PIN DIP (PLASTIC) 400mil
+ 0.1 05 0.25 - 0.
13
+ 0.4 30.2 - 0.1
24
+ 0.3 8.5 - 0.1
10.16
0 to 15
1 2.54
12
0.5 0.1 1.2 0.15
3.0 MIN
0.5 MIN
PACKAGE STRUCTURE
PACKAGE MATERIAL SONY CODE EIAJ CODE JEDEC CODE DIP-24P-01 DIP024-P-0400-A LEAD TREATMENT LEAD MATERIAL PACKAGE WEIGHT EPOXY RESIN SOLDER PLATING COPPER / 42 ALLOY 2.0g
CXA1645M
24PIN SOP (PLASTIC)
+ 0.4 15.0 - 0.1 24 13
+ 0.4 3.7 - 0.1
+ 0.4 1.85 - 0.15
0.15
+ 0.3 5.3 - 0.1
7.9 0.4
+ 0.2 0.1 - 0.05
0.45 0.1
1.27
+ 0.1 0.2 - 0.05
0.12 M
PACKAGE STRUCTURE
MOLDING COMPOUND SONY CODE EIAJ CODE JEDEC CODE SOP-24P-L01 SOP024-P-0300-A LEAD TREATMENT LEAD MATERIAL PACKAGE WEIGHT EPOXY/PHENOL RESIN SOLDER PLATING
COPPER ALLOY / 42ALLOY
0.3g
- 14 -
0.5 0.2
1
12
6.9

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